WLWE7002E6-27

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QCN9274 Industrial High-Power WiFi 7 (802.11be) 2×2 MU-MIMO
6 GHz Single Band Module

  • Qualcomm QCN9274-I ‘Waikiki’ series
  • MiniPCIe Interface with PCIe 3.0
  • 2x MMCX Connectors
  • -20°C to 70°C operating temperature, with customizable heatsink options available for optimal thermal performance
  • 57 mm × 62.7 mm × 14.2 mm (W x H x D)

 

Description

The WLWE7002E6-27 is a high-power, industrial-grade 6 GHz single-band Wi-Fi 7 (802.11be) MiniPCIe wireless module powered by the Qualcomm QCN9274-I “Waikiki” series chipset. Built on the WK01.6 reference design, it delivers high-throughput wireless connectivity for high-performance industrial and commercial network applications.

chipset

Qualcomm QCN9274-I

Powered by an industrial-grade Qualcomm ‘Waikiki’ chipset tailored for mission-critical and demanding industrial applications.

cutting-edge-perform

High-Power RF Transmission

Up to 26 dBm per chain with dual MMCX connectors for robust coverage.

form-factor

Industrial-Grade Reliability

Operates reliably from -20°C to 70°C, with customizable heatsinks available for extreme thermal demands.

Specifications

Standard
Chipset(s) Qualcomm QCN9274-I
Type of Connector(s) 2x MMCX Connectors
WiFi Interface PCIe 3.0

 

Wireless
Wireless 6 GHz 802.11ax/be, max 26dBm per chain
6 GHz 2×2 MU-MIMO, up to 5764Mbps
WLAN Frequency Range 5.925~7.125GHz
Channel Spectrum Widths for WLAN 20/40/80/160/320 MHz at 6 GHz

 

Power
Power Consumption 8.8W (Max)
Operating Voltage 3.3V, 5V

 

Environmental Compliances
USA REACH
EU Region RoHs

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